(1.00 mm) .0394" ZA1 SERIES
ZA1–40–2–1.00–Z–10
ZA1–20–1–1.00–Z–10–2
ZA1–30–2–1.00–Z–10
ZA1–10–2–1.00–Z–10
(1.00 mm) .040"
height
BeCu
contacts
Up to 1,024
contacts/
square inch
Dual compression
or single compression
with solder balls
25 g normal force
with (0.20 mm) .008"
contact deflection
Solder ball
option
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
F-219
ULTRA-LOW PROFILE MICRO ARRAYS
For complete specifications and
recommended PCB layouts see
www.samtec.com?ZA1
Insulator Material:
FR4
Contact Material:
BeCu
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating:
1 A per pin
(10 pins powered)
Operating Temp Range:
-55 °C to +105 °C
RoHS Compliant:
Ye s
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
POSITIONS
PER ROW A B
–10 (14.30)
.563
(11.40)
.449
–20 (24.30)
.957
(21.40)
.843
–30 (38.30)
1.508 N/A
–40 (48.30)
1.902 N/A
10 x 10 COMPRESSION
WITH SOLDER BALLS
(11.00)
.433
(0.20) .008 TYP
BOTH SIDES
A
A(1.00)
.039
(1.00)
.0394
(1.00)
.0394
(5.00)
.197
(11.00)
.433
(2.00) .079 DIA
(1.25)
.049
DIA
(1.07)
.042
DIA
B(1.09)
.043
B
20 x 10 DUAL COMPRESSION
40 X 10 DUAL COMPRESSION
®
SPECIFICATIONS
Gbps
14
HIGH-SPEED CHANNEL PERFORMANCE
1 mm Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
POSITIONS
PER ROW ROWS
PLATING
TERMINATION HEIGHT
–Z
= 6 µ"
(0.15 µm)
Gold in
contact
area
–10
= Ten
Rows
SOLDER
TYPE
ZA1
–10, –20,
–30, –40
(Termination
–1 only)
– 1
= Lead
– 2
= Lead-Free
–1.00
= (1.00 mm)
.040"
Height
–1
= Single Compression
with Solder Balls
(–10 & –20 positions only)
–2
= Dual Compression
(–10, –20, –30
& –40 positions only)
APPLICATION
20 X 10 COMPRESSION
WITH SOLDER BALLS
Note:
Solder ball parts will come
with a pick & place pad.
APPLICATION
Dual compression or single
compression with solder balls
DESIGN FLEXIBILITY
The Z-Ray® platform is
highly-customizable:
PITCH ≥ 0.65 mm
STACK HEIGHT 0.50 mm to
4.00 mm
DENSITY Up to 1,024
contacts/square inch
RUGGEDIZING
Latches, Thermal
Spreaders,
Quick-release
Spring Constraints
CONSTRUCTION Multi-layer FR4
(e.g., Pitch Spreaders)
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